Gunter Krasser, Infineon Technologies Romania: “While 2026 fundamentals remain solid, we must plan now for 2027–2029 to ensure we remain competitive in an increasingly challenging global market”

“As the automotive industry moves toward software-defined vehicles, the implications for semiconductor development are profound. We are entering a transformation, moving from chips with basic interfaces to advanced solutions with Ethernet connectivity. While these interfaces share similarities with the Ethernet we use at home, the automotive environment presents unique challenges. Safety requirements, electromagnetic interference, and other automotive-specific conditions make Ethernet far more demanding,” Gunter Krasser, Vice President and Managing Director, Infineon Technologies Romania said during Automotive Forum 2025 organized by Automotive Today and The Diplomat-Bucharest.

Key statements:

• Companies like Infineon and NXP have recognized this shift, making significant investments in automotive Ethernet and related software. Their commitment confirms that this trend is real, inevitable, and requires long-term preparation. Here in Romania, we are actively building the teams and competencies needed to design the chips of the future—highly digital, software-rich, and Ethernet-enabled. Achieving high-volume deployment in vehicles will take years of careful planning, investment, and development.

• Short-term supply security remains a pressing concern. In Europe, the production of power components for electric vehicles is largely self-sufficient, supported by a robust local value chain. Similarly, friendly Asian partners complement this supply network. Sensors, actuators, and system chips are mainly produced in Europe, with assembly partially handled in reliable overseas locations.

• While Taiwan’s geopolitical situation introduces risks for some chip types, collaborative efforts—like the joint venture between TSMC, NXP, and Bosch in Dresden—ensure that Europe can produce essential chips for automotive and industrial applications locally. This demonstrates that, although challenges exist, Europe is actively rebalancing its semiconductor value chain to maintain security and resilience.

• 2025 was a milestone year for us in Romania, with unprecedented growth thanks to our strategic investments in technology and talent. These successes validate our approach and underscore the opportunities ahead.

• Looking forward, maintaining competitiveness will require careful attention. Rising costs in Romania and the global competition for experienced engineers mean that we cannot rely solely on historical advantages.

• The ecosystem is crucial: universities, research institutes, and startups must contribute to training and developing the next generation of talent. Governments also play a role, implementing supportive measures that ensure the long-term development of skilled engineers.

• Our focus is clear: while 2026 fundamentals remain solid, we must plan now for 2027–2029 to ensure we remain competitive in an increasingly challenging global market. Only through investment in technology, talent, and ecosystem collaboration can we continue to lead in the semiconductor industry.